Meggitt (Sensorex) has its own design and production unit for thick film hybrid circuits using SMD die and bare chips transfer.

Thick film technology

  • Materials: ceramic substrate (Al203), aluminum nitride (ALN), steatite…
  • Thickness : 0.25mm to 6mm
  • Dimensions: up to 8’’x 8’’ (4’’x4’’ standard)
  • Conductors: Au / Ag / PdAg / PlAu / PlPdAg / …
  • Resistors: from 0.1MΩ to 100MΩ
  • Accuracy : up to 0.1%
  • TCR : 50ppm/°C to 100ppm/°C (<10ppm/°C differential)
  • Operating temperature : -55°C to +200°C
  • Conductors to widths : 90µm in thick film technology / 50µm in screen process printing / multi layers in thick film technology (7 layers) (single or double face) with metallized holes

Hybrid and Multi-Chip-Module

  • Die bonding
  • Automatic wire bonding (wedge and ball bonding) (ultrasonic or thermosonic with aluminum or gold wire)
  • Die protection with ceramic packaging, hermetic package (ceramic or Kovar) or automatic coating by « glob top »
  • Solder lead frame in SIL, DIL, SO (1.27mm to 2.54mm pitch)
  • Dynamical trimming (voltage, current and frequency)
  • Operating temperature : -55°C to +200°C
  • Automatic electrical tests between -55°C and +125°C

Chip on Board and SMD

  • Low cost hybrid process
  • Use of organical substrates
  • Die bonding
  • Automatic die protection by process « glob top »
  • Automatic surface mounting components (up to 9000 components per hour)
  • Re-melting welding
  • Final electrical test
  • Operating temperature : -40°C to +85°C